ASIC

Integrate customer needs and XinPal's unique technology to provide high-quality customized chip solutions for AI/GPU clients.

Design service

XinPal offers integrated IC design service from frond-end to back-end development, including logic design, software development, system development as well as package and testing.

IP solution

Xinpal can provide IP authorization service for various high-speed interconnect interface products, configurable for low power, small area and low latency.

Service Advantages

FinFET Technology

Able to access to the leading foundry process technologies to 5/7/14/16nm through our partnerships with the world's top foundries.

Product &Foundry Service

Provide the fab device and integration experience for first-time tapeout success.

Advanced Packaging Technology Support

Through Chiplet technology, we are able to provide higher flexibility, scalability products and improve production efficiency.

SoC Turnkey Service

Provide comprehensive services ranging from Design, Verification, DFT, Fabrication, Qualification,Characterization,feature addition and IP customization.